The curing process of refractory matter liquid resin is a complex and critical chemical change, which profoundly affects the final performance and application effect of refractory materials.
First of all, the curing of most refractory matter liquid resins is achieved through cross-linking reactions. Taking common phenolic resin as an example, under the conditions of heating or adding a curing agent, the active functional groups (such as hydroxyl and hydroxymethyl) in the resin molecules will react and gradually form a three-dimensional network structure. During this process, chemical bonds between molecules are continuously formed, causing the resin to gradually transform from a liquid state to a solid state, thus giving the refractory material a certain strength and stability.
Secondly, the curing agent plays an important role in the curing mechanism. Different types of curing agents trigger different reaction pathways. For example, acid curing agents can accelerate the polycondensation reaction of phenolic resin. The amount of curing agent has a significant impact on the curing speed. Increasing the curing agent in an appropriate amount can speed up the reaction rate of the active groups and shorten the curing time; however, if the amount is too much, the reaction may be too violent, causing the resin to cure unevenly, and even produce Internal stress affects the quality of refractory materials.
Furthermore, temperature is one of the key factors in controlling curing time. Generally speaking, increasing temperature will intensify molecular motion and increase reactivity. Within a certain range, the higher the temperature, the faster the resin solidifies. However, too high a temperature may cause the resin to solidify too quickly, resulting in insufficient time to fully infiltrate the refractory aggregate, or the generation of a large number of bubbles, reducing the density and performance of the refractory material.
Humidity can also affect the curing of some refractory matter liquid resins. For some moisture-sensitive resin systems, a high-humidity environment may change the curing reaction process of the resin and even lead to incomplete curing. For example, under humid conditions, part of the curing agent may hydrolyze, affecting its catalytic activity and thus prolonging the curing time.
In addition, the purity and impurity content of the resin itself are also related to the curing time. Resins with high purity have relatively more predictable and stable curing reactions. Impurities may interfere with the normal curing reaction, become the termination point of the reaction or change the reaction path, prolonging the curing time or worsening the curing effect.
In practical applications, in order to accurately control the curing time, the above factors need to be considered comprehensively. Determine the optimal curing agent dosage, temperature range and environmental conditions through experiments, and operate in strict accordance with the process requirements. At the same time, with the help of modern monitoring technology, such as thermal analysis methods (differential scanning calorimetry, etc.), the heat changes during the resin curing process are tracked in real time to more accurately grasp the curing process and ensure that the refractory matter liquid resin is completed within the appropriate time. Cured to achieve expected performance indicators.
