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How does refractory matter resin powder maintain stable bonding strength under high temperature environment?

Publish Time: 2024-12-24
Refractory matter resin powder is a binder used in high temperature environment, mainly used to manufacture refractory products such as castables, ramming materials, etc. These products need to work in high temperature environment, so the binder is required to maintain stable bonding strength under high temperature to ensure the structural integrity and performance stability of the products.

1. Chemical structure

Refractory matter resin powder is usually composed of polymer compounds containing active groups, such as phenolic resin, furan resin, etc. These resins undergo cross-linking reactions at high temperatures to form a three-dimensional network structure, which has high thermal stability and mechanical strength.

2. Cross-linking reaction

At high temperatures, cross-linking reactions occur between the active groups in the resin to form cross-linking points, which connect the resin molecules to each other to form a strong network structure. This cross-linking network can resist decomposition and softening at high temperatures, thereby maintaining bonding strength.

3. Carbonization

Some refractory matter resin powders undergo a carbonization process at high temperatures, that is, the organic components in the resin are converted into carbon, which has high thermal stability and chemical stability. This process not only enhances the heat resistance of the resin, but also improves its wear resistance and corrosion resistance.

4. Addition of inorganic fillers

In order to further improve the high-temperature performance of refractory matter resin powder, inorganic fillers such as high-melting-point substances such as alumina and zirconium oxide are often added. These fillers can interact with the resin at high temperatures to form a more stable composite structure, enhancing the overall heat resistance and mechanical strength.

5. Curing process

A reasonable curing process is crucial to the performance of refractory matter resin powder. By controlling the curing temperature and time, the cross-linking density and distribution of the resin can be optimized to obtain the best high-temperature stability and bonding strength.

6. Antioxidant properties

In high-temperature environments, the presence of oxygen may cause oxidative decomposition of the resin, thereby reducing bonding strength. Therefore, some refractory matter resin powders will add antioxidants to improve their stability in oxidative environments.

7. Thermal expansion coefficient matching

The thermal expansion coefficients of refractory matter resin powder and the inorganic materials (such as refractory aggregates) to which they are bonded should be matched as much as possible to reduce cracking and spalling caused by thermal stress, thereby maintaining bonding strength.

8. Sintering

At high temperatures, some organic components in refractory matter resin powder will volatilize or decompose, leaving a porous structure, which can be filled with inorganic fillers to form a dense sintered body, thereby improving the overall strength and stability.

9. Surface modification

Surface modification of resin powder, such as grafting modification and nano-modification, can improve its interface bonding with inorganic materials, improve bonding strength and high-temperature stability.

10. Formula design

By rationally designing the formula of resin powder, including selecting the appropriate resin type, adjusting the crosslinking density, adding additives, etc., its performance in high-temperature environments can be optimized.

In summary, refractory matter resin powder maintains stable bonding strength in high temperature environment through the comprehensive effects of its unique chemical structure, cross-linking reaction, carbonization, addition of inorganic fillers, control of curing process, improvement of antioxidant properties, matching of thermal expansion coefficient, sintering, surface modification and formula design.
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